Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/87033
Title: Magnetic Resonance Imaging Assisted by Wireless Passive Implantable Fiducial e-Markers
Authors: Gokyar, Sayim
Alipour, Akbar
Unal, Emre
Atalar, Ergin
Demir, Hilmi Volkan
Keywords: Magnetic Resonance Imaging
Wireless Resonators
Issue Date: 2017
Source: Gokyar, S., Alipour, A., Unal, E., Atalar, E., & Demir, H. V. (2017). Magnetic Resonance Imaging Assisted by Wireless Passive Implantable Fiducial e-Markers. IEEE Access, 5, 19693-19702.
Series/Report no.: IEEE Access
Abstract: This paper reports a wireless passive resonator architecture that is used as a fiducial electronic marker (e-marker) intended for internal marking purposes in magnetic resonance imaging (MRI). As a proof-of-concept demonstration, a class of double-layer, sub-cm helical resonators were microfabricated and tuned to the operating frequency of 123 MHz for a three T MRI system. Effects of various geometrical parameters on the resonance frequency of the e-marker were studied, and the resulting specific absorption rate (SAR) increase was analyzed using a full-wave microwave solver. The B1+ field distribution was calculated, and experimental results were compared. As an exemplary application to locate subdural electrodes, these markers were paired with subdural electrodes. It was shown that such sub-cm self-resonant e-markers with biocompatible constituents can be designed and used for implant marking, with sub-mm positioning accuracy, in MRI. In this application, a free-space quality factor (Q-factor) of approximately 50 was achieved for the proposed resonator architecture. However, this structure caused an SAR increase in certain cases, which limits its usage for in vivo imaging practices. The findings indicate that these implantable resonators hold great promise for wireless fiducial e-marking in MRI as an alternative to multimodal imaging.
URI: https://hdl.handle.net/10356/87033
http://hdl.handle.net/10220/44289
DOI: http://dx.doi.org/10.1109/ACCESS.2017.2752649
Rights: © 2017 IEEE. This work is licensed under a Creative Commons Attribution 3.0 License. For more information, see http://creativecommons.org/licenses/by/3.0/
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:EEE Journal Articles

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