Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/88255
Title: Ink evaporation on soft substrates for additive manufacturing of stretchable electronic devices : experimental studies
Authors: Saengchairat, Nitipon
Chua, Chee Kai
Tran, Tuan
Keywords: DRNTU::Engineering::Mechanical engineering::Prototyping
Ink Evaporation
Soft Substrates
Issue Date: 2018
Source: Saengchairat, N., Chua, C. K., & Tran, T. (2018). Ink evaporation on soft substrates for additive manufacturing of stretchable electronic devices : experimental studies. Proceedings of the 3rd International Conference on Progress in Additive Manufacturing (Pro-AM 2018), 121-126. doi:10.25341/D46K5D
Abstract: Additive manufacturing (AM) has emerged in various fields including prototyping, construction, biomedical science, and electronic fabrication. For manufacturing of electronics, several AM techniques have been developed, most notably droplet-based techniques such as inkjet and aerosol-jet printing. The progress in this field has been hindered due to the lack of appropriate materials, poor printing resolution, and lack of fundamental understanding on the deposition process of conductive materials. Typically for droplet-based printing, small droplets of a certain ink, i.e., micro- or nanoparticles suspended solvent, are ejected onto printed substrates. The ink droplets, after deposited on a substrate, evaporate leaving behind particles on the substrate. The evaporation process depends on various contributing parameters such as liquid properties, surface wettability, roughness, and stiffness. While this process has been extensively studied for rigid substrate, it has not been fully understood for soft substrates, which are relevant for fabrication of flexible and stretchable electronics. In this work, we study the effect of substrate's elasticity on evaporation process of suspension droplets. Variation in the elasticity plays a crucial role as it directly influences the morphology of the substrate at the triple-phase contact line, thus resulting in different deposited patterns of particles on the substrate. By fine-tuning the substract's elasticity, we expect that the electrical properties of the printed patterns can be manipulated.
URI: https://hdl.handle.net/10356/88255
http://hdl.handle.net/10220/45705
DOI: https://doi.org/10.25341/D46K5D
Rights: © 2018 Nanyang Technological University. Published by Nanyang Technological University, Singapore.
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:Pro-AM Conference Papers

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