Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/88303
Title: Band bending modification of inkjet-printed ZnO thin film for additive manufacturing of electronic devices
Authors: Tran, Van Thai
Wei, Yuefan
Du, Hejun
Keywords: Additive Manufacturing
Inkjet Printing
DRNTU::Engineering::Mechanical engineering::Prototyping
Issue Date: 2018
Source: Tran, V. T., Wei, Y., & Du, H. (2018). Band bending modification of inkjet-printed ZnO thin film for additive manufacturing of electronic devices. Proceedings of the 3rd International Conference on Progress in Additive Manufacturing (Pro-AM 2018), 95-100. doi:10.25341/D4W88N
Abstract: Among different approaches for additive manufacturing of electronic devices, inkjet printing is a potential method because it is capable of fabricating multi-material devices with good resolution. Meanwhile, zinc oxide (ZnO) is a wide-bandgap semiconductor, and it is an interesting material for electronic, optoelectronic and gas sensing devices. Hence, inkjet printing of ZnO is an attractive approach for additive manufacturing of functional devices. Band bending, caused by the exchanging of electrons at the surface of the semiconductor, has a significant effect on the performance of semiconductor devices in general and ZnO-based devices in particular. In this work, we present the modification of band bending of inkjet-printed ZnO thin film using thermal annealing. The results show a potential approach to improve the performance of the printed electronic device.
URI: https://hdl.handle.net/10356/88303
http://hdl.handle.net/10220/45710
DOI: https://doi.org/10.25341/D4W88N
Rights: © 2018 Nanyang Technological University. Published by Nanyang Technological University, Singapore.
metadata.item.grantfulltext: open
metadata.item.fulltext: With Fulltext
Appears in Collections:Pro-AM Conference Papers

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