Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/88964
Title: Parametric optimisation of heat treated recycling aluminium (AA6061) by response surface methodology
Authors: Yusuf, N. K.
Ahmad, A.
Lajis, M. A.
Shamsudin, S.
Zhong, Zhao Wei
Keywords: DRNTU::Engineering::Mechanical engineering
Aluminium
Response Surface Methodology
Issue Date: 2017
Source: Ahmad, A., Lajis, M. A., Yusuf, N. K., Shamsudin, S., & Zhong, Z. W. (2017). Parametric optimisation of heat treated recycling aluminium (AA6061) by response surface methodology. AIP Conference Proceedings, 1885, 020046-. doi:10.1063/1.5002240
Series/Report no.: AIP Conference Proceedings
Abstract: Alternating typical primary aluminium production with recycling route should benefit various parties, including the environment since the need of high cost and massive energy consumption will be ruled out. At present, hot extrusion is preferred as the effective solid-state recycling process compared to the typical method of melting the swarf at high temperature. However, the ideal properties of extruded product can only be achieved through a controlled process used to alter the microstructure to impart properties which benefit the working life of a component, which also known as heat treatment process. To that extent, this work ought to investigate the effect of extrusion temperature and ageing time on the hardness of the recycled aluminium chips. By employing Analysis of Variance (ANOVA) for full factorial design with centre point, a total of 11 runs were carried out randomly. Three dissimilar extrusion temperatures were used to obtain gear-shape billet. Extruded billets were cut and ground before entering the treatment phase at three different ageing times. Ageing time was found as the influential factor to affect the material hardness, rather than the extrusion temperature. Sufficient ageing time allows the impurity atoms to interfere the dislocation phenomena and yield great hardness. Yet, the extrusion temperatures still act to assist the bonding activities via interparticle diffusion transport matter.
URI: https://hdl.handle.net/10356/88964
http://hdl.handle.net/10220/46030
ISSN: 0094-243X
DOI: http://dx.doi.org/10.1063/1.5002240
Rights: © 2017 The Author(s) (Published by AIP). This paper was published in AIP Conference Proceedings and is made available as an electronic reprint (preprint) with permission of the author(s) (published by AIP). The published version is available at: [http://dx.doi.org/10.1063/1.5002240]. One print or electronic copy may be made for personal use only. Systematic or multiple reproduction, distribution to multiple locations via electronic or other means, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper is prohibited and is subject to penalties under law.
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:MAE Journal Articles

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