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|Title:||A review of interferometric techniques with possible improvement in pattern resolution using near-field patterning||Authors:||Pae, J. Y.
Murukeshan, Vadakke Matham
|Issue Date:||2017||Source:||Pae, J. Y., & Murukeshan, V. M. (2017). A review of interferometric techniques with possible improvement in pattern resolution using near-field patterning. Fifth International Conference on Optical and Photonics Engineering, 10449, 104491B-. doi:10.1117/12.2270638||Abstract:||In this paper, we will be initially doing review on the advancement of interference lithography (IL) which is a wellestablished technique for its facile, efficient, and economical approach to achieve large-scale patterning in a wide variety of substrates at sub-wavelength resolution. Following this, we have configured a two-beam IL patterning system to achieve patterns in a photoresist and verified against the theoretically calculated results. This work will be further extended using near-field patterning techniques to improve the resolution of the pattern as compared to the current conventional IL system. It is envisaged that the obtained initial results can be employed in a graphene substrate for further research and applications in the area of flexible electronics.||URI:||https://hdl.handle.net/10356/102552
|DOI:||http://dx.doi.org/10.1117/12.2270638||Rights:||© 2017 Society of Photo-optical Instrumentation Engineers (SPIE). This paper was published in Fifth International Conference on Optical and Photonics Engineering and is made available as an electronic reprint (preprint) with permission of Society of Photo-optical Instrumentation Engineers (SPIE). The published version is available at: [http://dx.doi.org/10.1117/12.2270638]. One print or electronic copy may be made for personal use only. Systematic or multiple reproduction, distribution to multiple locations via electronic or other means, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper is prohibited and is subject to penalties under law.||metadata.item.grantfulltext:||open||metadata.item.fulltext:||With Fulltext|
|Appears in Collections:||MAE Conference Papers|
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