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|Title:||Surface diffusion-limited lifetime of silver and copper nanofilaments in resistive switching devices||Authors:||Wang, Wei
|Issue Date:||2019||Source:||Wang, W., Wang, M., Ambrosi, E., Bricalli, A., Laudato, M., Sun, Z., . . . Ielmini, D. (2019). Surface diffusion-limited lifetime of silver and copper nanofilaments in resistive switching devices. Nature Communications, 10(1), 81-. doi:10.1038/s41467-018-07979-0||Series/Report no.:||Nature Communications||Abstract:||Silver/copper-filament-based resistive switching memory relies on the formation and disruption of a metallic conductive filament (CF) with relatively large surface-to-volume ratio. The nanoscale CF can spontaneously break after formation, with a lifetime ranging from few microseconds to several months, or even years. Controlling and predicting the CF lifetime enables device engineering for a wide range of applications, such as non-volatile memory for data storage, tunable short/long term memory for synaptic neuromorphic computing, and fast selection devices for crosspoint arrays. However, conflictive explanations for the CF retention process are being proposed. Here we show that the CF lifetime can be described by a universal surface-limited self-diffusion mechanism of disruption of the metallic CF. The surface diffusion process provides a new perspective of ion transport mechanism at the nanoscale, explaining the broad range of reported lifetimes, and paving the way for material engineering of resistive switching device for memory and computing applications.||URI:||https://hdl.handle.net/10356/88837
|DOI:||http://dx.doi.org/10.1038/s41467-018-07979-0||Rights:||© 2019 The Author(s). This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made. The images or other third party material in this article are included in the article’s Creative Commons license, unless indicated otherwise in a credit line to the material. If material is not included in the article’s Creative Commons license and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this license, visit http://creativecommons.org/licenses/by/4.0/.||Fulltext Permission:||open||Fulltext Availability:||With Fulltext|
|Appears in Collections:||MSE Journal Articles|
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