Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/90250
Title: Distributed control for a modular multilevel converter
Authors: Yang, Shunfeng
Tang, Yi
Wang, Peng
Keywords: Distributed Control Strategy
DRNTU::Engineering::Electrical and electronic engineering
Capacitor Voltage Control
Issue Date: 2017
Source: Yang, S., Tang, Y., & Wang, P. (2018). Distributed control for a modular multilevel converter. IEEE Transactions on Power Electronics, 33(7), 5578-5591. doi:10.1109/TPEL.2017.2751254
Series/Report no.: IEEE Transactions on Power Electronics
Abstract: Conventional centralized control strategies may reduce the flexibility and expandability of a modular multilevel converter (MMC) system. To tackle this issue, this paper proposes a distributed control architecture that is capable of assigning certain control tasks to distributed local controllers and improves the modularity of an MMC system. A central controller dealing with the output current regulation based on sensed arm currents is adopted. The control of MMC internal dynamics and the pulsewidth modulation (PWM) generation are distributed into local controllers. Unlike the conventional MMC control that needs all submodule capacitor voltages for capacitor voltage averaging, the proposed capacitor voltage control only relies on local submodule voltage measurement. Consequently, communication-intensive capacitor voltage transmission in each control cycle is not required and the communication burden of the control system can be significantly reduced. The control loops and possible control conflicts among submodules are presented and considered for system stability analysis. The effectiveness of the proposed distributed control architecture and capacitor voltage control for an MMC are confirmed by the start-up, steady state, and transient experimental results.
URI: https://hdl.handle.net/10356/90250
http://hdl.handle.net/10220/48466
ISSN: 0885-8993
DOI: http://dx.doi.org/10.1109/TPEL.2017.2751254
Rights: © 2017 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. The published version is available at: https://doi.org/10.1109/TPEL.2017.2751254
metadata.item.grantfulltext: open
metadata.item.fulltext: With Fulltext
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