Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/90267
Title: Hydrogen bond and surface stress relaxation by aldehydic and formic acidic molecular solvation
Authors: Chen, Jiasheng
Yao, Chuang
Zhang, Xi
Sun, Chang Q.
Huang, Yongli
Keywords: Solvation
Hydrogen Bond
DRNTU::Engineering::Electrical and electronic engineering
Issue Date: 2018
Source: Chen, J., Yao, C., Zhang, X., Sun, C. Q., & Huang, Y. (2018). Hydrogen bond and surface stress relaxation by aldehydic and formic acidic molecular solvation. Journal of Molecular Liquids, 249, 494-500. doi:10.1016/j.molliq.2017.11.088
Series/Report no.: Journal of Molecular Liquids
Abstract: Solvation of aldehydes and formic acids has an important impact to health care because these additives can damage DNA and denature proteins causing cancers with the mechanism behind remaining great challenge. From the perspective of solvent hydrogen bond (O:HO or HB with “:” being the electron lone pair of oxygen) transition from the mode of the ordinary water to the hydrating states, we examined the solvation bonding dynamics and the solute capabilities of O:HO bond and surface stress transition using differential Raman spectroscopy and contact angle detection. Results suggest that besides the short-range O:H van der Waals (vdW) bond, the H ↔ H and O: ⇔ :O repulsive intermolecular interactions, and the molecular dipolar polarization play important roles in disrupting the solution network and surface stress. Observations may infer the manner of DNA fragmentation by aldehyde and formic acid disruption.
URI: https://hdl.handle.net/10356/90267
http://hdl.handle.net/10220/48501
ISSN: 0167-7322
DOI: http://dx.doi.org/10.1016/j.molliq.2017.11.088
Rights: © 2017 Elsevier B.V. All rights reserved. This paper was published in Journal of Molecular Liquids and is made available with permission of Elsevier B.V.
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:EEE Journal Articles

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