dc.contributor.authorVaisband, Boris
dc.contributor.authorMaurice, Ange
dc.contributor.authorTan, Chong Wei
dc.contributor.authorTay, Beng Kang
dc.contributor.authorFriedman, Eby G.
dc.date.accessioned2019-06-04T06:52:30Z
dc.date.available2019-06-04T06:52:30Z
dc.date.issued2018
dc.identifier.citationVaisband, B., Maurice, A., Tan, C. W., Tay, B. K., & Friedman, E. G. (2018). Electrical and thermal models of CNT TSV and graphite interface. IEEE Transactions on Electron Devices, 65(5), 1880-1886. doi:10.1109/TED.2018.2812761en_US
dc.identifier.issn0018-9383en_US
dc.identifier.urihttp://hdl.handle.net/10220/48534
dc.description.abstractCarbon nanotubes (CNTs) are a suitable replacement for metals commonly used as a fill material for through substrate vias (TSVs). The electrical and thermal contact resistance, however, between the CNT TSVs and the horizontal metal interconnects (typically copper) can limit the use of CNT technology. A replacement for the horizontal metal interconnects in the form of graphite material is proposed in this paper. Electrical and thermal models of the interface between CNT TSVs and graphite interconnect are compared to the interface between CNT TSVs and copper interconnect. The proposed models include electrical and thermal crowding effects as well as the skin effect. The CNT/graphite interface exhibits up to 72.6% and 71.9%, respectively, lower electrical and thermal resistance as compared to the CNT/copper interface.en_US
dc.description.sponsorshipMOE (Min. of Education, S’pore)en_US
dc.format.extent6 p.en_US
dc.language.isoenen_US
dc.relation.ispartofseriesIEEE Transactions on Electron Devicesen_US
dc.rights© 2018 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. The published version is available at: https://doi.org/10.1109/TED.2018.2812761en_US
dc.subject3-D ICen_US
dc.subjectCarbon Nanotubesen_US
dc.subjectDRNTU::Engineering::Electrical and electronic engineeringen_US
dc.titleElectrical and thermal models of CNT TSV and graphite interfaceen_US
dc.typeJournal Article
dc.contributor.schoolSchool of Electrical and Electronic Engineeringen_US
dc.identifier.doihttp://dx.doi.org/10.1109/TED.2018.2812761
dc.description.versionAccepted versionen_US
dc.contributor.organizationNanoelectronics Center of Excellenceen_US


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