dc.contributor.authorChen, Zihao
dc.contributor.authorZhang, Yue Ping
dc.date.accessioned2019-11-07T03:32:15Z
dc.date.available2019-11-07T03:32:15Z
dc.date.issued2017
dc.identifier.citationChen, Z., & Zhang, Y. P. (2017). Mutual coupling between submicrostrip grid arrays on electrically thin substrate. IEEE Transactions on Antennas and Propagation, 66(1), 467-471. doi:10.1109/TAP.2017.2773494en_US
dc.identifier.issn0018-926Xen_US
dc.identifier.urihttp://hdl.handle.net/10220/50361
dc.description.abstractThis communication presents a study of mutual coupling between submicrostrip grid arrays on electrically thin substrate. It is found that the mutual coupling between subgrid arrays on electronically thin substrate is mainly caused by dielectric polarization currents. High isolation between subgrid arrays can be achieved by proper selection of the antenna array factor and size. A particular example of microstrip grid array antenna with five subarrays is developed on RT/duroid 5880 substrate for simultaneous transmit and receive application with high measured isolation of 65.07 dB at 24.15 GHz between transmitting and receiving antennas.en_US
dc.language.isoenen_US
dc.relation.ispartofseriesIEEE Transactions on Antennas and Propagationen_US
dc.rights© 2017 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. The published version is available at: https://doi.org/10.1109/TAP.2017.2773494.en_US
dc.subjectMutual Couplingen_US
dc.subjectMicrostrip Antennasen_US
dc.subjectEngineering::Electrical and electronic engineeringen_US
dc.titleMutual coupling between submicrostrip grid arrays on electrically thin substrateen_US
dc.typeJournal Article
dc.contributor.schoolSchool of Electrical and Electronic Engineeringen_US
dc.identifier.doihttp://dx.doi.org/10.1109/TAP.2017.2773494


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