Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/81439
Title: Hybrid K -means clustering and support vector machine method for via and metal line detections in delayered IC images
Authors: Cheng, Deruo
Shi, Yiqiong
Lin, Tong
Gwee, Bah-Hwee
Toh, Kar-Ann
Keywords: IC Image Analysis
Support Vector Machine
Engineering::Electrical and electronic engineering
Issue Date: 2018
Source: Cheng, D., Shi, Y., Lin, T., Gwee, B.-H., & Toh, K.-A. (2018). Hybrid K -means clustering and support vector machine method for via and metal line detections in delayered IC images. IEEE Transactions on Circuits and Systems II: Express Briefs, 65(12), 1849-1853. doi:10.1109/TCSII.2018.2827044
Series/Report no.: IEEE Transactions on Circuits and Systems II: Express Briefs
Abstract: This brief proposes a hybrid K-means clustering and support vector machine (HKCSVM) method to detect the positions of vias and metal lines from delayered IC images for subsequent netlist extraction. The main contributions of the proposed method include: 1) fully automated detection of via and metal line positions without any need of human interventions and 2) novel hybrid methodology to embody K-means clustering and support vector machine for retrieving precise positions of vias and metal lines in contrast to the individual techniques, which can only provide a region for the detected elements. From experiments on 50 SEM images of 1536 × 2048 pixels taken from fabricated IC chips (@TSMC 130-nm CMOS process), our proposed HKCSVM method achieves an F-score of 99.82% for via detection, and mean intersection over union of 94.44% and mean pixel accuracy of 95.83% for metal line detection, which are both superior to the reported approaches.
URI: https://hdl.handle.net/10356/81439
http://hdl.handle.net/10220/50385
ISSN: 1549-7747
DOI: http://dx.doi.org/10.1109/TCSII.2018.2827044
Rights: © 2018 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. The published version is available at: https://doi.org/10.1109/TCSII.2018.2827044
Fulltext Permission: open
Fulltext Availability: With Fulltext
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