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Title: Failure mechanisms of aluminum bondpad peeling during thermosonic bonding
Authors: Tan, Cher Ming
Gan, Zhenghao
Keywords: DRNTU::Engineering::Electrical and electronic engineering
Issue Date: 2003
Source: Tan, C. M., & Gan, Z. (2003). Failure mechanisms of aluminum bondpad peeling during thermosonic bonding. IEEE Transactions on Device and Materials Reliability, 3(2), 44-50.
Series/Report no.: IEEE transactions on device and materials reliability
Abstract: Aluminum bondpad peeling was observed in a newly developed thermosonic wirebonding process for chip-on-board assembly. Through detailed failure analysis and with the help of finite element analysis on stress simulation, the true root cause of the peeling is identified. It is found that the true root cause is the effect of skidding force as a result of the constrained movement of the bonding tool as bonding is done on a chip assembled in a plastic casing. With a change in the bonding tool movement, the peeling phenomenon is completely eliminated.
ISSN: 1530-4388
DOI: 10.1109/TDMR.2003.814408
Rights: © 2003 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder.
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:EEE Journal Articles

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