A study of dual-mode bandpass filter integrated in BGA package for single-chip RF transceivers
Zhang, Yue Ping
Li, Xue Jun
Phang, T. Y.
Date of Issue2006
School of Electrical and Electronic Engineering
This paper presents a study of a dual-mode bandpass filter integrated in a ball grid array (BGA) package for the single-chip solutions of radio frequency (RF) transceivers. The novel in-package filter, except for the economical advantage of mass production and automatic assembly, has potential benefit to the system-level board miniaturization and the system-level manufacturing facilitation. The simulated and measured performance of the in-package filter is presented. The effects of the different physical parts of the package on the filter performance are investigated. Experimental results show that the in-package filter of size 15 X 15 X 1.905 mm3 achieved 3-dB percentage bandwidth of 14% and insertion loss of 2.07 dB at 5.25 GHz.
DRNTU::Engineering::Electrical and electronic engineering
IEEE transactions on advanced packaging
IEEE Transactions on Advanced Packaging © 2006 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder. http://www.ieee.org/portal/site.