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|Title:||Antenna-in-package design for wirebond interconnection to highly integrated 60-GHz radios||Authors:||Wai, L. L.
Zhang, Yue Ping
Chua, Kai Meng
|Keywords:||DRNTU::Engineering::Electrical and electronic engineering||Issue Date:||2009||Source:||Zhang, Y. P., Wai, L. L., Chua, K. M., Sun, M., & Liu, D. (2009). Antenna-in-package design for wirebond interconnection to highly-integrated 60-GHz radios. IEEE Transactions on Antennas and Propagation. 57(10), 2842-2852.||Series/Report no.:||IEEE transactions on antennas and propagation||Abstract:||This paper first presents a quasi-cavity-backed, guard-ring-directed, substrate-material-modulated slot antenna. The antenna, intended for use in highly integrated 60-GHz radios, is deliberately designed to exhibit capacitive input impedance to suit low-cost wire-bonding packaging and assembly technique. The antenna implemented in a thin cavity-down ceramic ball grid array (CBGA) package in low-temperature cofired ceramic(LTCC) technology has achieved an acceptable impedance bandwidth from 59 to 65 GHz with an estimated efficiency of 94%. At millimeter-wave (mm-wave) frequency 60 GHz, one of key challenges is how to realize low-loss interconnection between a radio chip and an antenna using wire-bonding technique. This paper then addresses this issue in the framework of antenna-in-package (AiP) design at 60 GHz and proposes a new solution to the challenge. Detailed wirebond design method and results are given. A major concern with AiP is the risk of the antenna coupling to the radio chip. This paper also evaluates this unwanted coupling and shows that the coupling from the in-package antenna to the on-chip inductor is lower than 30 dB for the worst case. These results clearly demonstrate the feasibility and promise of the elegant AiP technology for emerging high-speed short-range 60-GHz wireless communications.||URI:||https://hdl.handle.net/10356/91527
|ISSN:||0018-926X||DOI:||10.1109/TAP.2009.2029290||Rights:||© 2009 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder. http://www.ieee.org/portal/site This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder.||Fulltext Permission:||open||Fulltext Availability:||With Fulltext|
|Appears in Collections:||EEE Journal Articles|
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