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Title: Study of low-temperature thermocompression bonding in Ag-In solder for packaging applications
Authors: Lau, John H.
Made, Riko I.
Gan, Chee Lip
Yan, Li Ling
Yu, Aibin
Yoon, Seung Wook
Lee, Chengkuo
Keywords: DRNTU::Engineering::Materials::Electronic packaging materials
DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films
Issue Date: 2009
Source: Made, R. I., Gan, C. L., Yan, L. L., Yu, A., Yoon, S. W., Lau, J. H., et al. (2009). Study of Low-Temperature Thermocompression Bonding in Ag-In Solder for Packaging Applications. Journal of Electronic Materials, 38, 365-371.
Series/Report no.: Journal of electronic materials
Abstract: Low-temperature solders have wide applications in integrated circuits and micro-electromechanical systems packaging. In this article, a study on Ag-In solder for chip-to-chip thermocompression bonding was carried out. The resulting joint consists of AgIn2 and Ag9In4 phases, with the latter phase having a melting temperature higher than 400 C. Complete consumption of In solder into a Ag-rich intermetallic compound is achieved by applying a bond pressure of 1.4 MPa at 180 C for 40 min. We also observe that the bonding pressure effect enables a Ag-rich phase to be formed within a shorter bonding duration (10 min) at a higher pressure of 1.6 MPa. Finally, prolonged aging leads to the formation of the final phase of Ag9In4 in the bonded joints.
ISSN: 0361-5235
DOI: 10.1007/s11664-008-0555-8
Rights: © 2008 TMS.
Fulltext Permission: none
Fulltext Availability: No Fulltext
Appears in Collections:MSE Journal Articles

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