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|Title:||Study of low-temperature thermocompression bonding in Ag-In solder for packaging applications||Authors:||Lau, John H.
Made, Riko I.
Gan, Chee Lip
Yan, Li Ling
Yoon, Seung Wook
|Keywords:||DRNTU::Engineering::Materials::Electronic packaging materials
DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films
|Issue Date:||2009||Source:||Made, R. I., Gan, C. L., Yan, L. L., Yu, A., Yoon, S. W., Lau, J. H., et al. (2009). Study of Low-Temperature Thermocompression Bonding in Ag-In Solder for Packaging Applications. Journal of Electronic Materials, 38, 365-371.||Series/Report no.:||Journal of electronic materials||Abstract:||Low-temperature solders have wide applications in integrated circuits and micro-electromechanical systems packaging. In this article, a study on Ag-In solder for chip-to-chip thermocompression bonding was carried out. The resulting joint consists of AgIn2 and Ag9In4 phases, with the latter phase having a melting temperature higher than 400 C. Complete consumption of In solder into a Ag-rich intermetallic compound is achieved by applying a bond pressure of 1.4 MPa at 180 C for 40 min. We also observe that the bonding pressure effect enables a Ag-rich phase to be formed within a shorter bonding duration (10 min) at a higher pressure of 1.6 MPa. Finally, prolonged aging leads to the formation of the ﬁnal phase of Ag9In4 in the bonded joints.||URI:||https://hdl.handle.net/10356/94437
|ISSN:||0361-5235||DOI:||http://dx.doi.org/10.1007/s11664-008-0555-8||Rights:||© 2008 TMS.||metadata.item.grantfulltext:||none||metadata.item.fulltext:||No Fulltext|
|Appears in Collections:||MSE Journal Articles|
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