dc.contributor.authorAng, X. F.
dc.contributor.authorLi, F. Y.
dc.contributor.authorTan, W. L.
dc.contributor.authorChen, Z.
dc.contributor.authorWong, Chee C.
dc.contributor.authorWei, J.
dc.identifier.citationAng, X. F., Li, F. Y., Tan, W. L., Chen, Z., Wong, C. C. & Wei, J. (2007). Self-assembled monolayers for reduced temperature direct metal thermocompression bonding. Applied Physics Letters, 91(6).en_US
dc.description.abstractA reduction in the bonding temperature required for direct gold-gold (Au–Au) thermocompression bonding is observed by coating a monolayer of dodecanethiol on gold surfaces prior to bonding. The results show that Au–Au bonded joints of 26.9 g per bump strength can be achieved at a temperature as low as 160 °C. The temperature drop becomes more apparent when both coated and blank gold samples are exposed in air over some time before bonding. The authors propose that self-assembled monolayers passivate metal surface by obviating the adsorption of surface contaminants, in particular, carbon and oxygen but get desorbed just before bonding takes place.en_US
dc.format.extent3 p.
dc.relation.ispartofseriesApplied physics lettersen_US
dc.rights© 2007 American Institute of Physics. This paper was published in Applied Physics Letters and is made available as an electronic reprint (preprint) with permission of American Institute of Physics. The paper can be found at the following DOI: http://dx.doi.org/10.1063/1.2768869. One print or electronic copy may be made for personal use only. Systematic or multiple reproduction, distribution to multiple locations via electronic or other means, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper is prohibited and is subject to penalties under law.en_US
dc.titleSelf-assembled monolayers for reduced temperature direct metal thermocompression bondingen_US
dc.typeJournal Article
dc.contributor.schoolSchool of Materials Science and Engineeringen_US
dc.description.versionPublished versionen_US

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