A mechanical assessment of flexible optoelectronic devices
Chua, Soo Jin
Date of Issue2001
School of Materials Science and Engineering
This work has demonstrated novel experimental methods and their relevant analysis to evaluate the fracture properties of thin brittle films on compliant substrates for flexible optoelectronic devices. Based on the understanding of the failure mechanisms, mechanical calculation has been provided to estimate the thin film fracture toughness and film delamination toughness. These values serve as design parameters on the device flexibility and reliability.
Thin solid films
© 2001 Elsevier Science B.V. This is the author created version of a work that has been peer reviewed and accepted for publication by Thin Solid Films, Elsevier Science B.V. It incorporates referee’s comments but changes resulting from the publishing process, such as copyediting, structural formatting, may not be reflected in this document. The published version is available at: DOI: [http://dx.doi.org/10.1016/S0040-6090(01)01138-5].