dc.contributor.authorChen, Zhong
dc.contributor.authorCotterell, Brian
dc.contributor.authorWang, Wei
dc.date.accessioned2012-05-28T09:08:02Z
dc.date.available2012-05-28T09:08:02Z
dc.date.copyright2002en_US
dc.date.issued2002
dc.identifier.citationChen, Z., Cotterell, B., & Wang, W. (2002). The Fracture of Brittle Thin Films on Compliant Substrates in Flexible Displays. Engineering Fracture Mechanics, 69(5), 597-603.en_US
dc.identifier.urihttp://hdl.handle.net/10220/8160
dc.description.abstractOne mechanical issue in flexible organic light emitting displays (OLED) is the fracture of extremely thin brittle conducting transparent oxide films deposited on thin flexible substrates. Understanding the behaviour of these films under flexed condition is essential for designer of flexible OLED. Controlled buckling experiments on the film and substrate have been designed to study the fracture of the films under both tension and compression. Fracture of the film is superficially similar in both tension and compression. However, under tension a channelling crack is formed, while under compression, the film delaminates, buckles and cracks in a tunnelling motion. The fracture toughness of the film and the delamination toughness have been estimated from these experiments. Design to maximise the flexibility of the device is discussed.en_US
dc.format.extent17 p.
dc.language.isoenen_US
dc.relation.ispartofseriesEngineering fracture mechanicsen_US
dc.rights© 2002 Elsevier Science Ltd. This is the author created version of a work that has been peer reviewed and accepted for publication by Engineering Fracture Mechanics, Elsevier Science Ltd. It incorporates referee’s comments but changes resulting from the publishing process, such as copyediting, structural formatting, may not be reflected in this document. The published version is available at: DOI: [http://dx.doi.org/10.1016/S0013-7944(01)00104-7].en_US
dc.subjectDRNTU::Engineering::Materials
dc.titleThe fracture of brittle thin films on compliant substrates in flexible displaysen_US
dc.typeJournal Article
dc.contributor.schoolSchool of Materials Science and Engineeringen_US
dc.identifier.doihttp://dx.doi.org/10.1016/S0013-7944(01)00104-7
dc.description.versionAccepted versionen_US


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