dc.contributor.authorXu, Hui
dc.contributor.authorLiu, Changqing
dc.contributor.authorSilberschmidt, Vadim V.
dc.contributor.authorChen, Z.
dc.contributor.authorWei, J.
dc.contributor.authorSivakumar, M.
dc.date.accessioned2012-06-27T02:57:34Z
dc.date.available2012-06-27T02:57:34Z
dc.date.copyright2010en_US
dc.date.issued2010
dc.identifier.citationXu, H., Liu, C., Silberschmidt, V. V., Chen, Z., Wei, J., & Sivakumar, M. (2011). Effect of bonding duration and substrate temperature in copper ball bonding on aluminium pads: a TEM study of interfacial evolution. Microelectronics reliability, 51(1), 113-118.en_US
dc.identifier.issn0026-2714en_US
dc.identifier.urihttp://hdl.handle.net/10220/8242
dc.description.abstractThe effect of bonding duration and substrate temperature on the nano-scale interfacial structure for bonding strength were investigated using high resolution transmission electron microscopy. It shows that intermetallic compound crystallization correlates with bonding duration, as a longer duration is applied, alumina fragmentation becomes pervasive, resulting in continuous alloy interfaces and robust bonds. In addition, a substrate temperature (i.e. 175 C) promotes the fracture of alumina, and simultaneously contributes to the interfacial temperature, accelerating interdiffusion and facilitating the formation of intermetallic compounds, therefore increasing bonding strength. The compound formed during bonding is CuAl2, regardless of the bonding parameters applied.en_US
dc.language.isoenen_US
dc.relation.ispartofseriesMicroelectronics reliabilityen_US
dc.rights© 2010 Elsevier. This is the author created version of a work that has been peer reviewed and accepted for publication by Microelectronics Reliability, Elsevier. It incorporates referee’s comments but changes resulting from the publishing process, such as copyediting, structural formatting, may not be reflected in this document. The published version is available at: [http://dx.doi.org/10.1016/j.microrel.2010.03.016].en_US
dc.subjectDRNTU::Engineering::Materials
dc.titleEffect of bonding duration and substrate temperature in copper ball bonding on aluminium pads : a TEM study of interfacial evolutionen_US
dc.typeJournal Article
dc.contributor.schoolSchool of Materials Science and Engineeringen_US
dc.identifier.doihttp://dx.doi.org/10.1016/j.microrel.2010.03.016
dc.description.versionAccepted versionen_US


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