Please use this identifier to cite or link to this item:
Title: Applications of multi-walled carbon nanotube in electronic packaging
Authors: Tan, Cher Ming
Baudot, Jacques Desire Charles
Han, Yongdian
Jing, Hongyang
Issue Date: 2012
Source: Tan, C. M., Baudot, J. D. C., Han, Y., & Jing, H. (2012). Applications of multi-walled carbon nanotube in electronic packaging. Nanoscale Research Letters, 7(1), 183.
Series/Report no.: Nanoscale Research Letters
Abstract: Thermal management of integrated circuit chip is an increasing important challenge faced today. Heat dissipation of the chip is generally achieved through the die attach material and solders. With the temperature gradients in these materials, high thermo-mechanical stress will be developed in them, and thus they must also be mechanically strong so as to provide a good mechanical support to the chip. The use of multi-walled carbon nanotube to enhance the thermal conductivity, and the mechanical strength of die attach epoxy and Pb-free solder is demonstrated in this work.
ISSN: 1556-276X
DOI: 10.1186/1556-276X-7-183
Rights: © 2012 The Authors.
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:EEE Journal Articles

Files in This Item:
File Description SizeFormat 
7. Applications of multi-walled carbon.pdf381.28 kBAdobe PDFThumbnail

Google ScholarTM




Items in DR-NTU are protected by copyright, with all rights reserved, unless otherwise indicated.