Applications of multi-walled carbon nanotube in electronic packaging
Tan, Cher Ming
Baudot, Jacques Desire Charles
Date of Issue2012
School of Electrical and Electronic Engineering
Thermal management of integrated circuit chip is an increasing important challenge faced today. Heat dissipation of the chip is generally achieved through the die attach material and solders. With the temperature gradients in these materials, high thermo-mechanical stress will be developed in them, and thus they must also be mechanically strong so as to provide a good mechanical support to the chip. The use of multi-walled carbon nanotube to enhance the thermal conductivity, and the mechanical strength of die attach epoxy and Pb-free solder is demonstrated in this work.
Nanoscale Research Letters
© 2012 The Authors.