Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/100180
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dc.contributor.authorYin, Shanen
dc.contributor.authorTseng, King Jeten
dc.contributor.authorZhao, Jiyunen
dc.date.accessioned2013-11-19T06:38:51Zen
dc.date.accessioned2019-12-06T20:17:55Z-
dc.date.available2013-11-19T06:38:51Zen
dc.date.available2019-12-06T20:17:55Z-
dc.date.copyright2013en
dc.date.issued2013en
dc.identifier.citationYin, S., Tseng, K. J., & Zhao, J. (2013). Design of AlN-based micro-channel heat sink in direct bond copper for power electronics packaging. Applied Thermal Engineering, 52(1), 120-129.en
dc.identifier.issn1359-4311en
dc.identifier.urihttps://hdl.handle.net/10356/100180-
dc.description.abstractA single-phase, laminar flow, rectangular, and AlN-based micro-channel heat sink (MCHS) with water coolant has been designed and optimized for power electronics packaging. By fabricating micro-channels in the AlN-layer of direct bond copper, the heat conduction path is minimized and high cooling performance of micro-channels is utilized. The scaling effects, including temperature-dependent fluid properties, entrance effect, viscous dissipation and conjugate heat transfer, are considered. Comparison between CFD simulation by ANSYS Fluent and well-established analytical correlations is carried out and importance of entrance effect is emphasized. For the optimal geometry, the total thermal resistance of the AlN-based MCHS is 0.128 K/W at a pressure drop of 66.6 kPa. The conventional packaging structures, in which the Cu-based MCHS is bonded to the direct bond copper by solder or thermal interface material, are investigated to compare with the proposed structure. The proposed structure shows a reduction in thermal resistance by 15% and 80% respectively.en
dc.format.extent11 p.en
dc.language.isoenen
dc.relation.ispartofseriesApplied thermal engineeringen
dc.rights© 2013 Elsevier.en
dc.subjectDRNTU::Engineering::Electrical and electronic engineering::Electronic packagingen
dc.titleDesign of AlN-based micro-channel heat sink in direct bond copper for power electronics packagingen
dc.typeJournal Articleen
dc.contributor.schoolSchool of Electrical and Electronic Engineeringen
dc.identifier.doi10.1016/j.applthermaleng.2012.11.014en
item.fulltextNo Fulltext-
item.grantfulltextnone-
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