Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/101173
Title: Emission pattern of surface-enhanced Raman scattering from single nanoparticle-film junction
Authors: Du, Luping
Tang, Dingyuan
Yuan, Guanghui
Wei, Shibiao
Yuan, Xiaocong
Keywords: DRNTU::Engineering::Electrical and electronic engineering
Issue Date: 2013
Source: Du, L., Tang, D., Yuan, G., Wei, S., & Yuan, X. (2013). Emission pattern of surface-enhanced Raman scattering from single nanoparticle-film junction. Applied Physics Letters, 102(8).
Series/Report no.: Applied physics letters
Abstract: Emission pattern of surface-enhanced Raman scattering (SERS) from the junction of single nanoparticle and a metal film was experimentally demonstrated. The presence of a thin metal film enables the excitation of surface plasmon polaritons (SPPs) to greatly improve the excitation efficiency of SERS, which is subsequently coupled back to SPPs and re-radiates into the substrate side with higher refractive index at SPP excitation angle. The so-called surface plasmon coupled emission can serve as a high sensitivity detection tool for SERS and particularly for the tip-enhanced Raman spectroscopy.
URI: https://hdl.handle.net/10356/101173
http://hdl.handle.net/10220/10993
ISSN: 0003-6951
DOI: 10.1063/1.4793667
Schools: School of Electrical and Electronic Engineering 
Rights: © 2013 American Institute of Physics. This paper was published in Applied Physics Letters and is made available as an electronic reprint (preprint) with permission of American Institute of Physics. The paper can be found at the following official DOI: [http://dx.doi.org/10.1063/1.4793667]. One print or electronic copy may be made for personal use only. Systematic or multiple reproduction, distribution to multiple locations via electronic or other means, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper is prohibited and is subject to penalties under law.
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:EEE Journal Articles

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