Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/101274
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dc.contributor.authorGao, Binen
dc.contributor.authorKang, Jinfengen
dc.contributor.authorChen, Bingen
dc.contributor.authorHuang, Pengen
dc.contributor.authorMa, Longen
dc.contributor.authorZhang, Feifeien
dc.contributor.authorLiu, Lifengen
dc.contributor.authorLiu, Xiaoyanen
dc.contributor.authorTran, Xuan Anhen
dc.contributor.authorYu, Hongyuen
dc.date.accessioned2013-10-10T01:03:18Zen
dc.date.accessioned2019-12-06T20:35:53Z-
dc.date.available2013-10-10T01:03:18Zen
dc.date.available2019-12-06T20:35:53Z-
dc.date.copyright2012en
dc.date.issued2012en
dc.identifier.citationGao, B., Kang, J., Chen, B., Huang, P., Ma, L., Zhang, F., Liu, L., Liu, X., Tran, X. A., & Yu, H. (2012). A novel self-selection bipolar RRAM cell with ultra-low operation currents for cross-point application. 2012 IEEE 11th International Conference on Solid-State and Integrated Circuit Technology (ICSICT), pp.1-3.en
dc.identifier.urihttps://hdl.handle.net/10356/101274-
dc.description.abstractA self-selection and self-compliance bipolar RRAM cell based on TiN/HfOx/n+-Si structure is proposed for the CMOS compatible and ultra low power cross-point array application. Electrical forming scheme is important to achieved desired resistive switching performance due to the existing of interface sub-oxide layer. For RRAM cell, ultra-low RESET current <; 0.5 μA and good reliability (retention @ 150 °C > 104 seconds and endurance > 104 cycles) are demonstrated after optimization by material-oriented methodology. The write and read operation could be performed correctly without additional selector.en
dc.language.isoenen
dc.subjectDRNTU::Engineering::Electrical and electronic engineeringen
dc.titleA novel self-selection bipolar RRAM cell with ultra-low operation currents for cross-point applicationen
dc.typeConference Paperen
dc.contributor.schoolSchool of Electrical and Electronic Engineeringen
dc.contributor.conferenceIEEE International Conference on Solid-State and Integrated Circuit Technology (11th : 2012 : Xi'an, China)en
dc.identifier.doi10.1109/ICSICT.2012.6467645en
item.grantfulltextnone-
item.fulltextNo Fulltext-
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