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https://hdl.handle.net/10356/101556
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DC Field | Value | Language |
---|---|---|
dc.contributor.author | Lee, Byunghoon | en |
dc.contributor.author | Jeon, Haseok | en |
dc.contributor.author | Kwon, Kee-Won | en |
dc.contributor.author | Lee, Hoo-Jeong | en |
dc.date.accessioned | 2013-10-16T08:51:57Z | en |
dc.date.accessioned | 2019-12-06T20:40:32Z | - |
dc.date.available | 2013-10-16T08:51:57Z | en |
dc.date.available | 2019-12-06T20:40:32Z | - |
dc.date.copyright | 2013 | en |
dc.date.issued | 2013 | en |
dc.identifier.citation | Lee, B., Jeon, H., Kwon, K. W., & Lee, H. J. (2013). Employment of a bi-layer of Ni(P)/Cu as a diffusion barrier in a Cu/Sn/Cu bonding structure for three-dimensional interconnects. Acta Materialia, 61(18), 6736-6742. | en |
dc.identifier.issn | 1359-6454 | en |
dc.identifier.uri | https://hdl.handle.net/10356/101556 | - |
dc.description.abstract | This study explored the possibility of employing a bi-layer barrier of electroless-plated Ni(P)/thin Cu layers in a Cu/Sn/Cu bonding structure for three-dimensional interconnects. Our materials analysis revealed that the bi-layer barrier served effectively as a diffusion barrier and prevented full-scale materials interaction for temperatures higher than 300 °C. Such suppression of an intermetallic compound reaction and limiting Cu diffusion led to the formation of a rod-shaped Cu6Sn5 compound, rendering a unique microstructure of ductile Sn embedded with strong Cu6Sn5 rods. Our mechanical characterization using lap-shear testing and fracture analysis revealed that the sample with such a microstructure displayed a high bonding strength with some ductility, a desirable combination for high mechanical reliability. | en |
dc.language.iso | en | en |
dc.relation.ispartofseries | Acta materialia | en |
dc.rights | © 2013 Acta Materialia Inc. | en |
dc.subject | DRNTU::Engineering::Materials::Metallic materials | en |
dc.title | Employment of a bi-layer of Ni(P)/Cu as a diffusion barrier in a Cu/Sn/Cu bonding structure for three-dimensional interconnects | en |
dc.type | Journal Article | en |
dc.contributor.school | School of Materials Science & Engineering | en |
dc.identifier.doi | 10.1016/j.actamat.2013.07.043 | en |
dc.identifier.rims | 174653 | en |
item.fulltext | No Fulltext | - |
item.grantfulltext | none | - |
Appears in Collections: | MSE Journal Articles |
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