Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/101826
Title: Charging and characterization of non-patterned organic micro electret arrays
Authors: Liu, Shuwei
Shen, Zhiyuan
Lye, Sun Woh
Miao, Jianmin
Keywords: DRNTU::Engineering::Mechanical engineering::Mechatronics
Issue Date: 2014
Source: Liu, S., Shen, Z., Lye, S. W., & Miao, J. (2014). Charging and characterization of non-patterned organic micro electret arrays. Journal of micromechanics and microengineering, 24(8), 085004-.
Series/Report no.: Journal of micromechanics and microengineering
Abstract: This paper presents the charging and characterization of organic micro electret array for vibration energy harvesting. Micro sized electrets with stable and high surface potential are essential for long-term effectiveness of micro electrostatic power generators which harvest low-level vibration energy. In this study, a localized corona charging method to obtain micro sized electret areas on non-patterned macro sized dielectric thin film has been proposed to solve the problem of low charging efficiency and fast charge decay of micro sized electrets. This method involves using a shadow mask to transfer charge patterns and a triode corona charging configuration to facilitate charge penetration. Charging efficiency of 93.6% is achieved on an electret area of 100µm × 100µm, and 87% of its initial surface potential remains on the shrunken area of 50µm × 50µm after 240 days of storage. A technique combining SEM surface topography and non-contact measurement of the average surface potential has been developed to map the charge distribution on locally charged dielectric thin film and measure the surface potential on the micro sized charged area by incorporating the layout characteristic of an micro electret array.
URI: https://hdl.handle.net/10356/101826
http://hdl.handle.net/10220/24174
DOI: 10.1088/0960-1317/24/8/085004
Rights: © 2014 IOP Publishing. This is the author created version of a work that has been peer reviewed and accepted for publication by Journal of Micromechanics and Microengineering, IOP Publishing. It incorporates referee’s comments but changes resulting from the publishing process, such as copyediting, structural formatting, may not be reflected in this document. The published version is available at: [http://dx.doi.org/10.1088/0960-1317/24/8/085004].
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:MAE Journal Articles

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