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Title: | Design and analysis of anchorless shuttle nano-electro-mechanical non-volatile memory for high temperature applications | Authors: | Vaddi, Ramesh Kim, Tony Tae-Hyoung Pott, Vincent Lin, Julius Tsai Ming |
Keywords: | DRNTU::Engineering::Electrical and electronic engineering | Issue Date: | 2012 | Source: | Vaddi, R., Kim, T. T., Pott, V., & Lin, J. T. M. (2012). Design and analysis of anchorless shuttle nano-electro-mechanical non-volatile memory for high temperature applications. 2012 IEEE International Reliability Physics Symposium (IRPS), pp.ME.3.1-ME.3.6. | Conference: | IEEE International Reliability Physics Symposium (2012 : Anaheim, California, US) | Abstract: | This paper presents a novel nano-electro-mechanical (NEM) non-volatile memory (NVM) based on an anchorless structure for high operating temperature (>;200°C). The proposed NEM NVM device has two stable mechanical states obtained by adhesion forces, and is actuated by electrostatic forces. This work further discusses the modeling of the NEM memory device and the scaling effects on the device performance. Finally, a memory cell consisting of the NEM memory device and two MOS transistors (1NEM-2T), and NEM NVM array structure are presented. | URI: | https://hdl.handle.net/10356/102307 http://hdl.handle.net/10220/16376 |
DOI: | 10.1109/IRPS.2012.6241917 | Schools: | School of Electrical and Electronic Engineering | Rights: | © 2012 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. The published version is available at DOI: [http://dx.doi.org/10.1109/IRPS.2012.6241917]. | Fulltext Permission: | open | Fulltext Availability: | With Fulltext |
Appears in Collections: | EEE Conference Papers |
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