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Title: Thermal test effect on fan-out wafer level package strength
Authors: Xu, Cheng
Zhong, Zhao Wei
Choi, W. K.
Keywords: Curing
Electromagnetic Compatibility
DRNTU::Engineering::Mechanical engineering
Issue Date: 2018
Source: Xu, C., Zhong, Z. W., & Choi, W. K. (2017). Thermal test effect on fan-out wafer level package strength. 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2017, 271-274. doi: 10.1109/IMPACT.2017.8255915
Abstract: Fan-out wafer level packaging technology becomes more and more popular and attractive of its flexibility for integration of diverse devices in a very small form factor and it is also a cost effective packaging solution. As fan-out wafer level package (FOWLP) is composed of various materials, the proper structural design and material selection are essential to achieve reliability requirements. In this study, FOWLP material especially the epoxy molding compound (EMC) thermal properties are evaluated to understand the effect of thermal factors on EMC strength. The long term thermal test is applied and the EMC flexure strength increases significantly after the high temperature storage test.
DOI: 10.1109/IMPACT.2017.8255915
Rights: © 2017 IEEE. Translations and content mining are permitted for academic research only. Personal use is also permitted, but republication/redistribution requires IEEE permission. See for more information.
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:MAE Conference Papers

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