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|Title:||A fractal image analysis methodology for heat damage inspection in carbon fiber reinforced composites||Authors:||Murukeshan, V. M.
|Issue Date:||2017||Source:||Haridas, A., Crivoi, A., Prabhathan, P., Chan, K.,& Murukeshan, V. M. (2017). A fractal image analysis methodology for heat damage inspection in carbon fiber reinforced composites. Fifth International Conference on Optical and Photonics Engineering, 10449, 104491L-. doi:10.1117/12.2270727||Abstract:||The use of carbon fiber-reinforced polymer (CFRP) composite materials in the aerospace industry have far improved the load carrying properties and the design flexibility of aircraft structures. A high strength to weight ratio, low thermal conductivity, and a low thermal expansion coefficient gives it an edge for applications demanding stringent loading conditions. Specifically, this paper focuses on the behavior of CFRP composites under stringent thermal loads. The properties of composites are largely affected by external thermal loads, especially when the loads are beyond the glass temperature, Tg, of the composite. Beyond this, the composites are subject to prominent changes in mechanical and thermal properties which may further lead to material decomposition. Furthermore, thermal damage formation being chaotic, a strict dimension cannot be associated with the formed damage. In this context, this paper focuses on comparing multiple speckle image analysis algorithms to effectively characterize the formed thermal damages on the CFRP specimen. This would provide us with a fast method for quantifying the extent of heat damage in carbon composites, thus reducing the required time for inspection. The image analysis methods used for the comparison include fractal dimensional analysis of the formed speckle pattern and analysis of number and size of various connecting elements in the binary image.||URI:||https://hdl.handle.net/10356/102524
|DOI:||10.1117/12.2270727||Rights:||© 2017 Society of Photo-optical Instrumentation Engineers (SPIE). This paper was published in Fifth International Conference on Optical and Photonics Engineering and is made available as an electronic reprint (preprint) with permission of Society of Photo-optical Instrumentation Engineers (SPIE). The published version is available at: [http://dx.doi.org/10.1117/12.2270727]. One print or electronic copy may be made for personal use only. Systematic or multiple reproduction, distribution to multiple locations via electronic or other means, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper is prohibited and is subject to penalties under law.||Fulltext Permission:||open||Fulltext Availability:||With Fulltext|
|Appears in Collections:||MAE Conference Papers|
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