Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/102618
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dc.contributor.authorAgarwala, Shwetaen
dc.contributor.authorLee, Jia Minen
dc.contributor.authorYeong, Wai Yeeen
dc.contributor.authorLayani, Michaelen
dc.contributor.authorMagdassi, Shlomoen
dc.date.accessioned2019-01-21T03:52:53Zen
dc.date.accessioned2019-12-06T20:57:40Z-
dc.date.available2019-01-21T03:52:53Zen
dc.date.available2019-12-06T20:57:40Z-
dc.date.issued2018en
dc.identifier.citationAgarwala, S., Lee, J. M., Yeong, W. Y., Layani, M., & Magdassi, S. (2018). 3D printed bioelectronic platform with embedded electronics. MRS Advances, 3(50), 3011-3017. doi:10.1557/adv.2018.431en
dc.identifier.urihttps://hdl.handle.net/10356/102618-
dc.identifier.urihttp://hdl.handle.net/10220/47523en
dc.description.abstractSilver nanoparticle based microelectrodes embedded between layers of hydrogel material were successfully fabricated. 3D bioprinting is employed to print the entire bioelectronics platform comprising of conducting silver ink and Gelatin methacryloyl (GelMA) hydrogel. The additive manufacturing technique of bioprinting gives design freedom for the circuit, saves material and shortens the time to fabricate the bioelectronics platform. The silver platform shows excellent electrical conductivity, structural flexibility and stability in wet environment. It is tested for biocompatibility using C2C12 murine myoblasts cell line. The work demonstrates the potential of the fabricated platform for the realization of practical bioelectronic devices.en
dc.description.sponsorshipNRF (Natl Research Foundation, S’pore)en
dc.format.extent7 p.en
dc.language.isoenen
dc.relation.ispartofseriesMRS Advancesen
dc.rights© 2018 Materials Research Society. All rights reserved. This paper was published in MRS Advances and is made available with permission of Materials Research Society.en
dc.subject3D Printingen
dc.subjectBioelectronicsen
dc.subjectDRNTU::Engineering::Aeronautical engineeringen
dc.title3D printed bioelectronic platform with embedded electronicsen
dc.typeJournal Articleen
dc.contributor.schoolSchool of Mechanical and Aerospace Engineeringen
dc.contributor.researchSingapore Centre for 3D Printingen
dc.identifier.doihttp://dx.doi.org/10.1557/adv.2018.431en
dc.description.versionPublished versionen
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Appears in Collections:MAE Journal Articles
SC3DP Journal Articles
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