Please use this identifier to cite or link to this item:
https://hdl.handle.net/10356/102892| Title: | Ultra-fine pitch palladium-coated copper wire bonding : effect of bonding parameters | Authors: | Lim, Adeline B. Y. Chang, Andrew C. K. Yauw, Oranna Chylak, Bob Gan, Chee Lip Chen, Zhong |
Keywords: | DRNTU::Engineering::Materials::Electronic packaging materials | Issue Date: | 2014 | Source: | Lim, A. B., Chang, A. C., Yauw, O., Chylak, B., Gan, C. L., & Chen, Z. (2014). Ultra-fine pitch palladium-coated copper wire bonding: Effect of bonding parameters. Microelectronics reliability, 54(11), 2555-2563. | Series/Report no.: | Microelectronics reliability | Abstract: | Copper (Cu) wire bonding has become a mainstream IC assembly solution due to its significant cost savings over gold wire. However, concerns on corrosion susceptibility and package reliability have driven the industry to develop alternative materials. In recent years, palladium-coated copper (PdCu) wire has become widely used as it is believed to improve reliability. In this paper, we experimented with 0.6 ml PdCu and bare Cu wires. Palladium distribution and grain structure of the PdCu Free Air Ball (FAB) were investigated. It was observed that Electronic Flame Off (EFO) current and the cover gas type have a significant effect on palladium distribution in the FAB. The FAB hardness was measured and correlated to palladium distribution and grain structure. First bond process responses were characterized. The impact of palladium on wire bondability and wire bond intermetallic using a high temperature storage test was studied. | URI: | https://hdl.handle.net/10356/102892 http://hdl.handle.net/10220/24289 |
ISSN: | 0026-2714 | DOI: | 10.1016/j.microrel.2014.05.005 | Schools: | School of Materials Science & Engineering | Rights: | © 2014 Elsevier Ltd. This is the author created version of a work that has been peer reviewed and accepted for publication by Microelectronics Reliability, Elsevier Ltd. It incorporates referee’s comments but changes resulting from the publishing process, such as copyediting, structural formatting, may not be reflected in this document. The published version is available at: [http://dx.doi.org/10.1016/j.microrel.2014.05.005]. | Fulltext Permission: | open | Fulltext Availability: | With Fulltext |
| Appears in Collections: | MSE Journal Articles |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| Ultra-fine pitch palladium-coated copper wire bonding effect of bonding parameters.pdf | 873.24 kB | Adobe PDF |  View/Open |
SCOPUSTM
Citations
20
21
Updated on Mar 22, 2025
Web of ScienceTM
Citations
20
14
Updated on Oct 27, 2023
Page view(s) 5
1,163
Updated on Mar 22, 2025
Download(s) 5
557
Updated on Mar 22, 2025
Google ScholarTM
Check
Altmetric
Items in DR-NTU are protected by copyright, with all rights reserved, unless otherwise indicated.