Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/103452
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dc.contributor.authorTee, Kheng Choken
dc.contributor.authorEe, Yong Chiangen
dc.contributor.authorAubel, Oliveren
dc.contributor.authorPey, Kin Leongen
dc.contributor.authorNg, Wee Loonen
dc.contributor.authorLiu, Junfengen
dc.contributor.authorTan, Chuan Sengen
dc.date.accessioned2014-12-22T02:39:42Zen
dc.date.accessioned2019-12-06T21:12:59Z-
dc.date.available2014-12-22T02:39:42Zen
dc.date.available2019-12-06T21:12:59Z-
dc.date.copyright2014en
dc.date.issued2014en
dc.identifier.citationNg, W. L., Tee, K. C., Liu, J., Ee, Y. C., Aubel, O., Tan, C. S., et al. (2014). Robust electromigration reliability through engineering optimization. Microelectronics reliability, 54(9-10), 1666-1670.en
dc.identifier.issn0026-2714en
dc.identifier.urihttps://hdl.handle.net/10356/103452-
dc.description.abstractWith complex process integration approach and severe fabrication limitations caused by introduction of new materials and diminishing process margins, there are mounting concerns with the increased failure rate at the early life cycle (e.g.<1 year operation) of product application known as infant mortality failures. A paradigm change in reliability qualification methodology aim at understanding the impact of variation on reliability is required to ensure reliability robustness. Using Electromigration (EM) as an example, this paper described a methodology where the impact of process variation on reliability is studied. A model that predicts the impact of process variation on EM sigma is also proposed which enables variation and its impact on reliability to be quantified. Using this methodology, the critical process parameters impacting reliability could be identified and controlled to ensure reliability robustness.en
dc.format.extent3 p.en
dc.language.isoenen
dc.relation.ispartofseriesMicroelectronics reliabilityen
dc.rights© 2014 Elsevier Ltd. This is the author created version of a work that has been peer reviewed and accepted for publication by Microelectronics Reliability, Elsevier Ltd. It incorporates referee’s comments but changes resulting from the publishing process, such as copyediting, structural formatting, may not be reflected in this document. The published version is available at: [Article DOI: http://dx.doi.org/10.1016/j.microrel.2014.07.096].en
dc.subjectDRNTU::Engineering::Electrical and electronic engineering::Microelectronicsen
dc.titleRobust electromigration reliability through engineering optimizationen
dc.typeJournal Articleen
dc.contributor.schoolSchool of Electrical and Electronic Engineeringen
dc.identifier.doi10.1016/j.microrel.2014.07.096en
dc.description.versionAccepted versionen
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