Please use this identifier to cite or link to this item:
https://hdl.handle.net/10356/103452
Title: | Robust electromigration reliability through engineering optimization | Authors: | Tee, Kheng Chok Ee, Yong Chiang Aubel, Oliver Pey, Kin Leong Ng, Wee Loon Liu, Junfeng Tan, Chuan Seng |
Keywords: | DRNTU::Engineering::Electrical and electronic engineering::Microelectronics | Issue Date: | 2014 | Source: | Ng, W. L., Tee, K. C., Liu, J., Ee, Y. C., Aubel, O., Tan, C. S., et al. (2014). Robust electromigration reliability through engineering optimization. Microelectronics reliability, 54(9-10), 1666-1670. | Series/Report no.: | Microelectronics reliability | Abstract: | With complex process integration approach and severe fabrication limitations caused by introduction of new materials and diminishing process margins, there are mounting concerns with the increased failure rate at the early life cycle (e.g.<1 year operation) of product application known as infant mortality failures. A paradigm change in reliability qualification methodology aim at understanding the impact of variation on reliability is required to ensure reliability robustness. Using Electromigration (EM) as an example, this paper described a methodology where the impact of process variation on reliability is studied. A model that predicts the impact of process variation on EM sigma is also proposed which enables variation and its impact on reliability to be quantified. Using this methodology, the critical process parameters impacting reliability could be identified and controlled to ensure reliability robustness. | URI: | https://hdl.handle.net/10356/103452 http://hdl.handle.net/10220/24506 |
ISSN: | 0026-2714 | DOI: | 10.1016/j.microrel.2014.07.096 | Rights: | © 2014 Elsevier Ltd. This is the author created version of a work that has been peer reviewed and accepted for publication by Microelectronics Reliability, Elsevier Ltd. It incorporates referee’s comments but changes resulting from the publishing process, such as copyediting, structural formatting, may not be reflected in this document. The published version is available at: [Article DOI: http://dx.doi.org/10.1016/j.microrel.2014.07.096]. | Fulltext Permission: | open | Fulltext Availability: | With Fulltext |
Appears in Collections: | EEE Journal Articles |
Files in This Item:
File | Description | Size | Format | |
---|---|---|---|---|
Robust Electromigration Reliability Through Engineering Optimization.pdf | 376.12 kB | Adobe PDF | ![]() View/Open |
Page view(s) 20
641
Updated on Mar 24, 2023
Download(s) 20
216
Updated on Mar 24, 2023
Google ScholarTM
Check
Altmetric
Items in DR-NTU are protected by copyright, with all rights reserved, unless otherwise indicated.