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Title: Fully laser-patterned stretchable microsupercapacitors integrated with soft electronic circuit components
Authors: Park, Sangbaek
Lee, Hyub
Kim, Young-Jin
Lee, Pooi See
Keywords: Polydimethylsiloxane
Issue Date: 2018
Source: Park, S., Lee, H., Kim, Y.-J., & Lee, P. S. (2018). Fully laser-patterned stretchable microsupercapacitors integrated with soft electronic circuit components. NPG Asia Materials, 10(10), 959-969. doi:10.1038/s41427-018-0080-z
Series/Report no.: NPG Asia Materials
Abstract: Stretchable energy storage devices are prerequisites for the realization of autonomous elastomeric electronics. Microsupercapacitors (MSCs) are promising candidates for this purpose due to their high power and energy densities, potential for miniaturization, and feasibility of embedding in circuits; however, efforts to realize stretchable MSCs have mostly relied on strain-accommodating materials and have suffered from limited stretchability, low conductivity, or complicated patterning processes. Here, we designed and fabricated a stretchable MSC based on reduced-graphene-oxide/Au heterostructures patterned by facile and versatile direct laser patterning. An interconnected and stable 3D network composed of vertically oriented heterostructures was realized by high-repetition-rate femtosecond laser pulses. Upon transferring to polydimethylsiloxane (PDMS), the 3D network achieved a high conductivity of ~105 S m−1, and the conductivity could be maintained at ~104 S m−1 even at 50% strain. A fully laser-patterned stretchable electronics system was integrated with embedded MSCs, which will find applications in soft robotics, wearable electronics, and the Internet of Things.
DOI: 10.1038/s41427-018-0080-z
Rights: © 2018 The Author(s). This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made. The images or other third party material in this article are included in the article’s Creative Commons license, unless indicated otherwise in a credit line to the material. If material is not included in the article’s Creative Commons license and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this license, visit
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:MAE Journal Articles
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