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Title: Indentation damage evaluation on metal-coated thin-films stacked structure
Authors: Yeo, Alfred
Liu, Mao
Zhou, Kun
Keywords: Acoustic emission
Indentation damage
Issue Date: 2015
Source: Yeo, A., Liu, M., & Zhou, K. Indentation damage evaluation on metal-coated thin-films stacked structure. Journal of Materials Research, 30(20), 3071-3083.
Series/Report no.: Journal of Materials Research
Abstract: A micro-indentation system integrated with an acoustic emission (AE) sensor is used as a damage test method for crack detection of the specimen during the indentation loading–unloading cycle. The specimens investigated are the Si die, and various stacked structures of metallization (Al or Cu) deposited over the dielectric layers (SiO2 or Si3N4) on the Si substrate. The 1st AE event detected during the loading stage corresponded to the ‘pop-in’ observation in the force–displacement curve, which was related to the brittle cracking in the dielectric or Si substrate. However, during unloading, a 2nd AE event was detected, but no “pop-out” was observed, which was mainly due to the delamination between the dielectric and Si substrate. It was also found that for Si die, “pop-out” was observed without any AE event during the unloading stage, which was related to the Si phase transformation. This observation is unique to sharp indenter tip but not for a blunt indenter tip.
DOI: 10.1557/jmr.2015.278
Rights: © 2015 Materials Research Society. This paper was published in Journal of Materials Research and is made available as an electronic reprint (preprint) with permission of Materials Research Society. The published version is available at: []. One print or electronic copy may be made for personal use only. Systematic or multiple reproduction, distribution to multiple locations via electronic or other means, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper is prohibited and is subject to penalties under law.
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:MAE Journal Articles

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