Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/104595
Title: Self-healing epoxy via epoxy–amine chemistry in dual hollow glass bubbles
Authors: Zhang, He
Wang, Pengfei
Yang, Jinglei
Keywords: DRNTU::Engineering::Aeronautical engineering::Aerodynamics
Issue Date: 2014
Source: Zhang, H., Wang, P., & Yang, J. (2014). Self-healing epoxy via epoxy–amine chemistry in dual hollow glass bubbles. Composites Science and Technology, 94, 23-29.
Series/Report no.: Composites science and technology
Abstract: Etched hollow glass bubbles (HGBs) with through-holes at micron level were used as micro-containers for epoxy and amine solution to realize the self-healing functionality in epoxy matrix. The average diameter, the average shell thickness, as well as the cavity inside the shell were investigated. In order to check the mechanical robustness and the rupturability of the HGBs, micro-compression tests of single HGB were conducted to measure their mechanical responses, which reveal the relatively high compressive strength and brittle feature. A new type of self-healing epoxy was developed based on the dual HGB carriers and the self-healing performance was optimized systematically to obtain better healing behavior. It is found the highest healing efficiency of about 62% was achieved at 50 °C for 24 h when 12.5 - 15.0 wt% healing agent carriers was incorporated at the optimized ratio of 4 : 1 for epoxy loaded HGBs (HGB-E) to amine loaded HGBs (HGB-A). It is also found that the healing efficiency increased with increased healing duration at 50 °C. In addition, the fracture toughness is improved and the tensile modulus keeps constant while the tensile strength is deteriorated by the incorporation of the carriers.
URI: https://hdl.handle.net/10356/104595
http://hdl.handle.net/10220/20262
ISSN: 0266-3538
DOI: 10.1016/j.compscitech.2014.01.009
Rights: © 2014 Elsevier Ltd. This is the author created version of a work that has been peer reviewed and accepted for publication by Composites Science and Technology, Elsevier Ltd. It incorporates referee’s comments but changes resulting from the publishing process, such as copyediting, structural formatting, may not be reflected in this document. The published version is available at: [http://dx.doi.org/10.1016/j.compscitech.2014.01.009]
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:MAE Journal Articles

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