Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/105063
Title: Fundamental locally one-dimensional method for 3-D thermal simulation
Authors: Tay, Wei Choon
Tan, Eng Leong
Heh, Ding Yu
Keywords: DRNTU::Engineering::Electrical and electronic engineering
Issue Date: 2014
Source: Tay, W. C., Tan, E. L., & Heh, D. Y. (2014). Fundamental locally one-dimensional method for 3-D thermal simulation. IEICE transactions on electronics, E97.C(7), 636-644.
Series/Report no.: IEICE transactions on electronics
Abstract: This paper presents a fundamental locally one-dimensional (FLOD) method for 3-D thermal simulation. We first propose a locally one-dimensional (LOD) method for heat transfer equation within general inhomogeneous media. The proposed LOD method is then cast into compact form and formulated into the FLOD method with operator-free right-hand-side (RHS), which leads to computationally efficient update equations. Memory storage requirements and boundary conditions for both FLOD and LOD methods are detailed and compared. Stability analysis by means of analyzing the eigenvalues of amplification matrix substantiates the stability of the FLOD method. Additionally, the potential instability of the Douglas Gunn (DG) alternating-direction-implicit (ADI) method for inhomogeneous media is demonstrated. Numerical experiments justify the gain achieved in the overall efficiency for FLOD over LOD, DG-ADI and explicit methods. Furthermore, the relative maximum error of the FLOD method illustrates good trade-off between accuracy and efficiency.
URI: https://hdl.handle.net/10356/105063
http://hdl.handle.net/10220/20410
ISSN: 0916-8524
DOI: 10.1587/transele.E97.C.636
Schools: School of Electrical and Electronic Engineering 
Rights: © 2014 The Institute of Electronics, Information and Communication Engineers. This paper was published in IEICE Transactions on Electronics and is made available as an electronic reprint (preprint) with permission of The Institute of Electronics, Information and Communication Engineers. The paper can be found at the following official DOI: http://dx.doi.org/10.1587/transele.E97.C.636.  One print or electronic copy may be made for personal use only. Systematic or multiple reproduction, distribution to multiple locations via electronic or other means, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper is prohibited and is subject to penalties under law.
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:EEE Journal Articles

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