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https://hdl.handle.net/10356/105170
Title: | Design and fabrication of a holey fiber microfluidic device with transverse micro-channel | Authors: | Shum, Perry Ping Lim, Jun Long Humbert, Georges Auguste, Jean-Louis Wang, Yixin Hu, Dora Juan Juan Cui, Ying |
Keywords: | DRNTU::Engineering::Electrical and electronic engineering::Electric power::Production, transmission and distribution | Issue Date: | 2014 | Source: | Hu, D. J. J., Cui, Y., Lim, J. L., Shum, P. P., Humbert, G., Auguste, J.-L., et al. (2014). Design and fabrication of a holey fiber microfluidic device with transverse micro-channel. Photonics letters of Poland, 6(2), 53-55. | Series/Report no.: | Photonics letters of Poland | Abstract: | In this report, we present a design of holey fiber structure with six air holes in the cladding and a transverse microfluidic channel intersecting the silica core for liquid detection purpose. The simulation results suggest an improved refractive index sensitivity of the proposed structure compared to that of a single mode fiber with similar transverse channel. The proposed holey fiber structures are fabricated and characterized. | URI: | https://hdl.handle.net/10356/105170 http://hdl.handle.net/10220/20449 |
URL: | http://photonics.pl/PLP/index.php/letters/article/viewArticle/6-19 | Schools: | School of Electrical and Electronic Engineering | Rights: | © 2014 Photonics Society of Poland. This paper was published in Photonics Letters of Poland and is made available as an electronic reprint (preprint) with permission of Photonics Society of Poland. The paper can be found at the following official DOI: [http://photonics.pl/PLP/index.php/letters/article/viewArticle/6-19]. One print or electronic copy may be made for personal use only. Systematic or multiple reproduction, distribution to multiple locations via electronic or other means, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper is prohibited and is subject to penalties under law. | Fulltext Permission: | open | Fulltext Availability: | With Fulltext |
Appears in Collections: | EEE Journal Articles |
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