Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/105177
Title: Comparison of pin-fin and finned shape heat sink for power electronics in future aircraft
Authors: Sakanova, Assel
Tseng, King Jet
Keywords: Perforated Pin
Computational Fluid Dynamics
DRNTU::Engineering::Electrical and electronic engineering
Issue Date: 2018
Source: Sakanova, A., & Tseng, K. J. (2017). Comparison of pin-fin and finned shape heat sink for power electronics in future aircraft. Applied Thermal Engineering, 136, 364-374. doi:10.1016/j.applthermaleng.2018.03.020
Series/Report no.: Applied Thermal Engineering
Abstract: This study investigates the heat transfer performance of finned and pin-fin heat sinks for high power density converter in future aircraft. There is a lack of studies evaluating the cooling performance of pin-fin as compared to the finned heat sink configuration. The influence of the aspects such as type of fluid flow (laminar or turbulent), type of working fluid (fuel or air) and geometry configuration (pin-fin or finned shaped heat sink) on heat transfer performance is compared. Circular, cone and hydrofoil pin fin arrays are considered. It is concluded that the thermal performance of pin-fin heat sink is superior to the finned configuration by 1.6-2 times in all cases except when fuel coolant is employed at turbulent flow. As weight of heat sink is concerned, the use of pin-fin shape can reduce half the weight of heat sink. The results of this paper are the guidance which can be applied while designing the heat sink for power electronics in future aircraft.
URI: https://hdl.handle.net/10356/105177
http://hdl.handle.net/10220/47881
ISSN: 1359-4311
DOI: 10.1016/j.applthermaleng.2018.03.020
Schools: School of Electrical and Electronic Engineering 
Research Centres: Rolls-Royce@NTU Corporate Lab 
Rights: © 2017 Elsevier Ltd. All rights reserved. This paper was published in Applied Thermal Engineering and is made available with permission of Elsevier Ltd.
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:EEE Journal Articles

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