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Title: Configurable three-dimensional boron nitride-carbon architecture and its tunable electronic behavior with stable thermal performances
Authors: Loeblein, Manuela
Tay, Roland Yingjie
Tsang, Siu Hon
Ng, Wei Beng
Teo, Edwin Hang Tong
Keywords: DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
Issue Date: 2014
Source: Loeblein, M., Tay, R. Y., Tsang, S. H., Ng, W. B., & Teo, E. H. T. (2014). Configurable Three-Dimensional Boron Nitride-Carbon Architecture and Its Tunable Electronic Behavior with Stable Thermal Performances. Small, 10(15), 2992-2999.
Series/Report no.: Small
Abstract: Recent developments of 3D-graphene and 3D-boron-nitride have become of great interest owing to their potential for ultra-light flexible electronics. Here we demonstrate the first synthesis of novel 3D-BNC hybrids. By specifically controlling the compositions of C and BN, new fascinating properties are observed, such as highly tunable electrical conductivity, controllable EMI shielding properties, and stable thermal conductivity. This ultra-light hybrid opens up many new applications such as for electronic packaging and thermal interface materials (TIMs).
ISSN: 1613-6810
DOI: 10.1002/smll.201400292
Rights: © 2014 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.
Fulltext Permission: none
Fulltext Availability: No Fulltext
Appears in Collections:EEE Journal Articles
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