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Title: A low-profile three-dimensional neural probe array using a silicon lead transfer structure
Authors: Cheng, Ming-Yuan
Je, Minkyu
Tan, Kwan Ling
Tan, Ee Lim
Lim, Ruiqi
Yao, Lei
Li, Peng
Park, Woo-Tae
Phua, Eric Jian Rong
Gan, Chee Lip
Yu, Aibin
Keywords: DRNTU::Engineering::Materials
Issue Date: 2013
Source: Cheng, M.-Y., Je, M., Tan, K. L., Tan, E. L., Lim, R., Yao, L., et al. (2013). A low-profile three-dimensional neural probe array using a silicon lead transfer structure. Journal of micromechanics and microengineering, 23(9), 095013.
Series/Report no.: Journal of micromechanics and microengineering
Abstract: This paper presents a microassembly method for low-profile three-dimensional probe arrays for neural prosthesis and neuroscience applications. A silicon (Si) lead transfer structure, Si interposer, is employed to form electrical connections between two orthogonal planes—the two dimensional probes and the dummy application-specific integrated circuit (ASIC) chip. In order to hold the probe array and facilitate the alignment of probes during assembly, a Si platform is designed to have through-substrate slots for the insertion of probes and cavities for holding the Si interposers. The electrical interconnections between the probes and the dummy ASIC chip are formed by solder reflow, resulting in greatly improved throughput in the proposed assembly method. Moreover, since the backbone of the probe can be embedded inside the cavity of the Si platform, the profile of the probe array above the cortical surface can be controlled within 750 µm. This low-profile allows the probe array not to touch the skull after it is implanted on the brain. The impedance of the assembled probe is also measured and discussed.
DOI: 10.1088/0960-1317/23/9/095013
Fulltext Permission: none
Fulltext Availability: No Fulltext
Appears in Collections:MSE Journal Articles

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