Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/106737
Title: Design, simulation and characterization of wheatstone bridge structured metal thin film uncooled microbolometer
Authors: Ang, Wan Chia
Kropelnicki, Piotr
Tsai, Julius Ming Lin
Leong, Kam Chew
Tan, Chuan Seng
Keywords: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films
Issue Date: 2014
Source: Ang, W. C., Kropelnicki, P., Tsai, J. M. L., Leong, K. C., & Tan, C. S. (2014). Design, simulation and characterization of wheatstone bridge structured metal thin film uncooled microbolometer. Procedia engineering, 94, 6-13.
Series/Report no.: Procedia Engineering
Abstract: It is demonstrated for the first time that the Wheatstone bridge structured metal thin film resistive uncooled microbolometer (in short, WB-bolometer) provides promising temperature sensitivity. This paper describes the design, simulation, and characterization of WB-bolometer using titanium nitride (TiN) thin film as the infrared (IR) sensing material. TiN thin film is designed into four resistors which are connected to each other in Wheatstone bridge configuration. The resistance value of each resistor changes with different rates upon IR absorption, which can be attributed to the difference in their associated thermal conductance. As a result, the bridge output voltage varies in response to the absorbed IR power. Simulation was employed to compare and characterize different designs of WB-bolometer. It was found that design with two sensing elements has the optimum performance. The proposed WB-bolometer is also capable of operating at elevated temperatures (> 250 oC) due to its adjustable and small initial offset voltage with minimum associated noise.
URI: https://hdl.handle.net/10356/106737
http://hdl.handle.net/10220/25084
DOI: 10.1016/j.proeng.2013.10.013
Rights: © 2014 Chuan Seng Tan. Published by Elsevier Ltd. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/3.0/).
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:EEE Conference Papers

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