Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/107093
Title: Fabrication and characterization of germanium-on-insulator through epitaxy, bonding, and layer transfer
Authors: Lee, Kwang Hong
Bao, Shuyu
Chong, Gang Yih
Tan, Yew Heng
Fitzgerald, Eugene A.
Tan, Chuan Seng
Keywords: DRNTU::Science::Physics
Issue Date: 2014
Source: Lee, K. H., Bao, S., Chong, G. Y., Tan, Y. H., Fitzgerald, E. A., & Tan, C. S. (2014). Fabrication and characterization of germanium-on-insulator through epitaxy, bonding, and layer transfer. Journal of applied physics, 116(10), 103506-.
Series/Report no.: Journal of applied physics
Abstract: A scalable method to fabricate germanium on insulator (GOI) substrate through epitaxy, bonding, and layer transfer is reported. The germanium (Ge) epitaxial film is grown directly on a silicon (Si) (001) donor wafer using a “three-step growth” approach in a reduced pressure chemical vapour deposition. The Ge epilayer is then bonded and transferred to another Si (001) wafer to form the GOI substrate. The Ge epilayer on GOI substrate has higher tensile strain (from 0.20% to 0.35%) and rougher surface (2.28 times rougher) compared to the Ge epilayer before transferring (i.e., Ge on Si wafer). This is because the misfit dislocations which are initially hidden along the Ge/Si interface are now flipped over and exposed on the top surface. These misfit dislocations can be removed by either chemical mechanical polishing or annealing. As a result, the Ge epilayer with low threading dislocations density level and surface roughness could be realized.
URI: https://hdl.handle.net/10356/107093
http://hdl.handle.net/10220/25327
ISSN: 0021-8979
DOI: 10.1063/1.4895487
Rights: © 2014 American Institute of Physics. This paper was published in Journal of Applied Physics and is made available as an electronic reprint (preprint) with permission of American Institute of Physics. The paper can be found at the following official DOI: [http://dx.doi.org/10.1063/1.4895487].  One print or electronic copy may be made for personal use only. Systematic or multiple reproduction, distribution to multiple locations via electronic or other means, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper is prohibited and is subject to penalties under law.
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:EEE Journal Articles

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