Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/107222
Title: Low thermal-mass LEDs : size effect and limits
Authors: Lu, Shunpeng
Liu, Wei
Zhang, Zi-Hui
Tan, Swee Tiam
Ju, Zhengang
Ji, Yun
Zhang, Xueliang
Zhang, Yiping
Zhu, Binbin
Kyaw, Zabu
Hasanov, Namig
Sun, Xiao Wei
Demir, Hilmi Volkan
Keywords: DRNTU::Engineering::Electrical and electronic engineering::Optics, optoelectronics, photonics
Issue Date: 2014
Source: Lu, S., Liu, W., Zhang, Z.-H., Tan, S. T., Ju, Z., Ji, Y., et al. (2014). Low thermal-mass LEDs: size effect and limits. Optics express, 22(26), 32200-32207.
Series/Report no.: Optics express
Abstract: In this work, low thermal-mass LEDs (LTM-LEDs) were developed and demonstrated in flip-chip configuration, studying both experimentally and theoretically the enhanced electrical and optical characteristics and the limits. LTM-LED chips in 25 × 25 μm2, 50 × 50 μm2, 100 × 100 μm2 and 200 × 200 μm2 mesa sizes were fabricated and comparatively investigated. Here it was revealed that both the electrical and optical properties are improved by the decreasing chip size due to the reduced thermal mass. With a smaller chip size (from 200 μm to 50 μm), the device generally presents higher current density against the bias and higher power density against the current density. However, the 25 × 25 μm2 device behaves differently, limited by the fabrication margin limit of 10 μm. The underneath mechanisms of these observations are uncovered, and furthermore, based on the device model, it is proven that for a specific flip-chip fabrication process, the ideal size for LTM-LEDs with optimal power density performance can be identified.
URI: https://hdl.handle.net/10356/107222
http://hdl.handle.net/10220/25305
ISSN: 1094-4087
DOI: 10.1364/OE.22.032200
Rights: © 2014 Optical Society of America. This is the author created version of a work that has been peer reviewed and accepted for publication by Optics Express, Optical Society of America. It incorporates referee’s comments but changes resulting from the publishing process, such as copyediting, structural formatting, may not be reflected in this document. The published version is available at: [http://dx.doi.org/10.1364/OE.22.032200].
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:EEE Journal Articles

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