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https://hdl.handle.net/10356/107318| Title: | Laser focus depth adaptation for decapsulation of copper wirebonded devices | Authors: | Kor, Katherine Hwee Boon Liu, Qing Siah, Yu Wen Gan, Chee Lip |
Keywords: | DRNTU::Engineering::Materials::Metallic materials | Issue Date: | 2014 | Source: | Kor, H. B., Liu, Q., Siah, Y. W., & Gan, C. L. (2014). Laser focus depth adaptation for decapsulation of copper wirebonded devices. Conference Proceedings from the 40th International Symposium for Testing and Failure Analysis, 94-99. | Conference: | 40th International Symposium for Testing and Failure Analysis | Abstract: | Although pre-laser decapsulation reduces the time to acid exposure for subsequent chemical decapsulation of copper wirebonded devices, it can result in severely damaged or broken copper wirebonds if carried out at a focused depth followed by chemical decapsulation. Thin quad flat packages (TQFPs) of dimensions 22 mm × 22 mm, with copper wirebonds were pre-laser decapped (Nd:YAG laser, 1064 nm) at three depths of focus, at focus, (z-0.5) mm and (z-1) mm. Reducing the laser focus depth by 1 mm, followed by subsequent chemical decapsulation, resulted in the least damage to copper wirebonds. Average percentage reduction in copper wirebond diameter after complete (laser and chemical) decapsulation is about 2.30%. | URI: | https://hdl.handle.net/10356/107318 http://hdl.handle.net/10220/25336 |
URL: | http://www.asminternational.org/web/edfas/technical?p_p_auth=ob3PcFz5&p_p_id=101&p_p_lifecycle=0&p_p_state=maximized&_101_struts_action=%2Fasset_publisher%2Fview_content&_101_assetEntryId=22674956&_101_type=content&_101_groupId=10192&_101_urlTitle=laser-focus-depth-adaptation-for-decapsulation-of-copper-wirebonded-devices | Schools: | School of Materials Science & Engineering | Research Centres: | Temasek Laboratories | Rights: | © 2014 ASM International. This paper was published in Conference Proceedings from the 40th International Symposium for Testing and Failure Analysis and is made available as an electronic reprint (preprint) with permission of ASM International. The paper can be found at the following official URL: [http://www.asminternational.org/web/edfas/technical?p_p_auth=ob3PcFz5&p_p_id=101&p_p_lifecycle=0&p_p_state=maximized&_101_struts_action=%2Fasset_publisher%2Fview_content&_101_assetEntryId=22674956&_101_type=content&_101_groupId=10192&_101_urlTitle=laser-focus-depth-adaptation-for-decapsulation-of-copper-wirebonded-devices]. One print or electronic copy may be made for personal use only. Systematic or multiple reproduction, distribution to multiple locations via electronic or other means, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper is prohibited and is subject to penalties under law. | Fulltext Permission: | open | Fulltext Availability: | With Fulltext |
| Appears in Collections: | MSE Conference Papers TL Conference Papers |
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|---|---|---|---|---|
| Laser Depth Adaptation for Decapsulation of Copper Wirebonded Devices.pdf | 1.36 MB | Adobe PDF |  View/Open |
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