Please use this identifier to cite or link to this item:
https://hdl.handle.net/10356/13421
Title: | Design of a heat flux sensor by MEMS technology | Authors: | Wan, Siew Ping | Keywords: | DRNTU::Engineering::Manufacturing::Product design DRNTU::Engineering::Electrical and electronic engineering::Microelectromechanical systems |
Issue Date: | 1999 | Abstract: | The purpose of this report is to look into the design, fabrication and calibration of a heat flux sensor using MEMS technology. MEMS technology is the acronym for microelectromechanical systems, which is a spin-off from the wafer fabrication techniques of the semiconductor industry. This is a system of design and fabrication techniques that works in the dimensional range of micron and sub-micron and it involves expertise in electronic, electrical, chemical, and mechanical field. The micro thermal sensor measuring heat flux is designed based on thermocouple principle and is configured as a large circular thermopile. By using the design and fabrication techniques of MEMS technology, the large thermopile consisting of various thin-film layers can be contain in a small volume, making it possible to have a micro-sensor. | URI: | http://hdl.handle.net/10356/13421 | Schools: | School of Mechanical and Production Engineering | Fulltext Permission: | restricted | Fulltext Availability: | With Fulltext |
Appears in Collections: | MAE Theses |
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File | Description | Size | Format | |
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WAN_SIEW_PING_1999.pdf Restricted Access | 6.53 MB | Adobe PDF | View/Open |
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