Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/13433
Title: Development of a compact PCB cooling system comprising a flexible bellow and a closed two phase thermosyphon
Authors: Lee, Boon Liang
Keywords: DRNTU::Engineering::Manufacturing::Product engineering
Issue Date: 1998
Abstract: The report documents the development of a flexible bellow heat sink with finned thermosyphons. The main objective of this project was to demonstrate the working principle of the thermosyphon with flexible bellow in electronic cooling. It involves the design, fabrication as well as testing of the finned thermosyphons and the whole cooling unit. A test rig was also set up to conduct tests of each thermosyphon and the entire system.
URI: http://hdl.handle.net/10356/13433
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MAE Theses

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