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|Title:||Development of a compact PCB cooling system comprising a flexible bellow and a closed two phase thermosyphon||Authors:||Lee, Boon Liang||Keywords:||DRNTU::Engineering::Manufacturing::Product engineering||Issue Date:||1998||Abstract:||The report documents the development of a flexible bellow heat sink with finned thermosyphons. The main objective of this project was to demonstrate the working principle of the thermosyphon with flexible bellow in electronic cooling. It involves the design, fabrication as well as testing of the finned thermosyphons and the whole cooling unit. A test rig was also set up to conduct tests of each thermosyphon and the entire system.||URI:||http://hdl.handle.net/10356/13433||Fulltext Permission:||restricted||Fulltext Availability:||With Fulltext|
|Appears in Collections:||MAE Theses|
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