Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/13437
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dc.contributor.authorChan, Kai Chong.en_US
dc.date.accessioned2008-09-01T01:06:07Zen_US
dc.date.accessioned2008-10-20T08:18:06Z-
dc.date.available2008-09-01T01:06:07Zen_US
dc.date.available2008-10-20T08:18:06Z-
dc.date.copyright1998en_US
dc.date.issued1998en_US
dc.identifier.urihttp://hdl.handle.net/10356/13437-
dc.description.abstractPopcorn package cracking in plastic IC packaging can be classified into three types: Type I referring to failure originating from delamination between the mold compound and die pad interface, Type II originating from the die attach region, and Type in originating from the interface between the mold compound and the silicon die. Recent advance in packaging design, process and materials such as mold compound have been effective in eliminating or reducing the occurrence of Type I and HI failures. However, Type II failures remain prevalent. The present work describes the results of a vigorous study to investigate the properties of various die attach materials that affect Type II popcorn cracking using a TQFP 208 package as a test vehicle. In addition, the work also reports the failure mechanism of Type II failure using SAM (scanning acoustic microscopy) as a failure analysis tool.en_US
dc.format.extent189 p.en_US
dc.language.isoenen_US
dc.subjectDRNTU::Engineering::Manufacturingen_US
dc.titleNon-destructive evaluation of microelectronic componentsen_US
dc.typeThesisen_US
dc.contributor.supervisorWong, Brian Stephenen_US
dc.contributor.schoolSchool of Mechanical and Production Engineeringen_US
dc.description.degreeMaster of Science (Mechanical Engineering)en_US
item.grantfulltextrestricted-
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