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https://hdl.handle.net/10356/13444| Title: | To study and implement inkless binning : in semiconductor industry | Authors: | Venkatachalam Valliappan | Keywords: | DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging | Issue Date: | 1999 | Abstract: | This thesis introduces a wafer mapping based inkless binning process for wafer sorting to segregate and identify the electrical and functional good dies and reject dies and using the map to pick up the good dies in die attach operation in the semiconductor IC packaging industry. | URI: | http://hdl.handle.net/10356/13444 | Schools: | School of Mechanical and Production Engineering | Fulltext Permission: | restricted | Fulltext Availability: | With Fulltext |
| Appears in Collections: | MAE Theses |
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| File | Description | Size | Format | |
|---|---|---|---|---|
| VENKATACHALAM_VALLIAPPAN_1999.pdf Restricted Access | 6.45 MB | Adobe PDF | View/Open |
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