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Title: To study and implement inkless binning : in semiconductor industry
Authors: Venkatachalam Valliappan
Keywords: DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
Issue Date: 1999
Abstract: This thesis introduces a wafer mapping based inkless binning process for wafer sorting to segregate and identify the electrical and functional good dies and reject dies and using the map to pick up the good dies in die attach operation in the semiconductor IC packaging industry.
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MAE Theses

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