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https://hdl.handle.net/10356/13448| Title: | Thermal stress analysis of electronic packaging components | Authors: | See Toh, Chee Wai. | Keywords: | DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging | Issue Date: | 1998 | Abstract: | The stress and strain behaviour of surface-mounted electronic packaging components under temperature cycling fatigue and creep deformations was investigated by non-linear three dimensional finite element method. In this research, solder joints of a PQFP package with a corner lead and solder joints of a CBGA package were studied. | URI: | http://hdl.handle.net/10356/13448 | Schools: | School of Mechanical and Production Engineering | Fulltext Permission: | restricted | Fulltext Availability: | With Fulltext |
| Appears in Collections: | MAE Theses |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| SEE_TOH_CHEE_WAI_1998.pdf Restricted Access | 9.71 MB | Adobe PDF | View/Open |
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