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https://hdl.handle.net/10356/13489
Title: | Analysis of temperature profile on a PCB in the preheat section of a wave soldering process | Authors: | Hoe, Swee Long. | Keywords: | DRNTU::Engineering::Manufacturing::Product engineering | Issue Date: | 1998 | Abstract: | In the Printed Circuit Board Assembly Industry, a well defined temperature profile in the preheat section of a wave soldering machine is essential for good solderability, quality and product reliability. A proper preheat to PCB and electronic components will eliminate defects due to thermal shock, poor soldering joints and unreliable leads connection. In practice, this proper preheat profile is achieved through a time consuming trial-and-error method and years of experience in wave soldering process control. | URI: | http://hdl.handle.net/10356/13489 | Fulltext Permission: | restricted | Fulltext Availability: | With Fulltext |
Appears in Collections: | MAE Theses |
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File | Description | Size | Format | |
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HOE_SWEE_LONG_1998.pdf Restricted Access | 11.18 MB | Adobe PDF | View/Open |
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