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|Title:||Analysis of temperature profile on a PCB in the preheat section of a wave soldering process||Authors:||Hoe, Swee Long.||Keywords:||DRNTU::Engineering::Manufacturing::Product engineering||Issue Date:||1998||Abstract:||In the Printed Circuit Board Assembly Industry, a well defined temperature profile in the preheat section of a wave soldering machine is essential for good solderability, quality and product reliability. A proper preheat to PCB and electronic components will eliminate defects due to thermal shock, poor soldering joints and unreliable leads connection. In practice, this proper preheat profile is achieved through a time consuming trial-and-error method and years of experience in wave soldering process control.||URI:||http://hdl.handle.net/10356/13489||Fulltext Permission:||restricted||Fulltext Availability:||With Fulltext|
|Appears in Collections:||MAE Theses|
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