Please use this identifier to cite or link to this item:
Title: Analysis of temperature profile on a PCB in the preheat section of a wave soldering process
Authors: Hoe, Swee Long.
Keywords: DRNTU::Engineering::Manufacturing::Product engineering
Issue Date: 1998
Abstract: In the Printed Circuit Board Assembly Industry, a well defined temperature profile in the preheat section of a wave soldering machine is essential for good solderability, quality and product reliability. A proper preheat to PCB and electronic components will eliminate defects due to thermal shock, poor soldering joints and unreliable leads connection. In practice, this proper preheat profile is achieved through a time consuming trial-and-error method and years of experience in wave soldering process control.
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MAE Theses

Files in This Item:
File Description SizeFormat 
  Restricted Access
11.18 MBAdobe PDFView/Open

Page view(s) 50

Updated on Jan 28, 2023


Updated on Jan 28, 2023

Google ScholarTM


Items in DR-NTU are protected by copyright, with all rights reserved, unless otherwise indicated.